High speed SLVS transmitter and receiver

被引:3
作者
Bulbakov, I. S. [1 ]
Atkin, E. V. [1 ]
Voronin, A. G. [1 ,2 ]
机构
[1] Natl Res Nucl Univ, MEPhI Moscow Engn Phys Inst, Kashirskoe Highway 31, Moscow 115409, Russia
[2] Moscow MV Lomonosov State Univ, SINP, 1 2 Leninskie Gory,GSP 1, Moscow 119991, Russia
来源
INTERNATIONAL CONFERENCE ON PARTICLE PHYSICS AND ASTROPHYSICS (ICPPA-2015), PTS 1-4 | 2016年 / 675卷
关键词
D O I
10.1088/1742-6596/675/4/042035
中图分类号
P1 [天文学];
学科分类号
0704 ;
摘要
Design of SLVS chip-to-chip communication transmitter/receiver IP block in 180 nm UMC MMRF CMOS process is presented. This block has been developed for study a data transmission over PCBs and/or electrical cables (lines) of few meters length at rates up to 320 Mb/s. Schematic for on-chip tests is also presented. This blocks are used for communication between front-end ASICs and DAQ system.
引用
收藏
页数:4
相关论文
共 4 条
  • [1] [Anonymous], JESD8132001 JEDEC SO
  • [2] Bonacini S., 2009, PROC TOP WORKSHOP EL, P422, DOI [10.5170/CERN-2009-006.422, DOI 10.5170/CERN-2009-006.422]
  • [3] LVDS I/O interface for Gb/s-per-pin operation in 0.35-μm CMOS
    Boni, A
    Pierazzi, A
    Vecchi, D
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2001, 36 (04) : 706 - 711
  • [4] Hernandez Hugo Daniel, 2014, DESIGN REV SLVS TX R