Sustaining Moore's Law with 3D Chips

被引:24
作者
DeBenedictis, Erik P. [1 ]
Badaroglu, Mustafa [2 ]
Chen, An [3 ]
Conte, Thomas M. [4 ]
Gargini, Paolo [5 ]
机构
[1] Sandia Natl Labs, Ctr Comp Res, Livermore, CA 94550 USA
[2] Qualcomm, Livermore, CA USA
[3] SRC, Nanoelect Res Initiat, Livermore, CA USA
[4] Georgia Tech, Atlanta, GA USA
[5] IRDS, Atlanta, GA USA
关键词
3D chip manufacturing; chip stacking; history of computing; International Roadmap for Devices and Systems; IRDS; machine learning; monolithic; 3D; Moore's law; neural network; Rebooting Computing;
D O I
10.1109/MC.2017.3001236
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Rather than continue the expensive and time-consuming quest for transistor replacement, the authors argue that 3D chips coupled with new computer architectures can keep Moore's law on its scaling path.
引用
收藏
页码:69 / 73
页数:5
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