Validation study of compact thermal resistance models of IC packages

被引：1
作者：
Yang, ZM [1 ]
Kwon, Y [1 ]
机构：
[1] PHILIPS SEMICOND,IC PACKAGE TECHNOL DEV,SUNNYVALE,CA 94088
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.517389
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：165 / 171
页数：3
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