Validation study of compact thermal resistance models of IC packages

被引：1
|
作者：
Yang, ZM [1 ]
Kwon, Y [1 ]
机构：
[1] PHILIPS SEMICOND,IC PACKAGE TECHNOL DEV,SUNNYVALE,CA 94088
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.517389
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：165 / 171
页数：3
相关论文
共 50 条
  • [21] An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards
    Rencz, M
    Székely, V
    Poppe, A
    Courtois, B
    PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 293 - 298
  • [22] DEVELOPMENT OF BOUNDARY CONDITION INDEPENDENT COMPACT THERMAL MODELS FOR OPTO-ELECTRONIC PACKAGES
    Raghupathy, Arun Prakash
    Aranyosi, Attila
    Ghia, Urmila
    Ghia, Karman
    maltz, William
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 2, 2010, : 741 - 751
  • [23] On the performance of compact thermal models of electronic chip packages in conjugate board level simulation
    DeVoe, J
    Ortega, A
    Berhe, M
    NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2003, : 313 - 318
  • [24] Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
    Raghupathy, Arun Prakash
    Janssen, John
    Aranyosi, Attila
    Ghia, Urmila
    Ghia, Karman
    Maltz, William
    JOURNAL OF ELECTRONIC PACKAGING, 2011, 133 (01)
  • [25] Validation procedure developed for compact thermal microelectronic package models
    不详
    JOURNAL OF RESEARCH OF THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, 1997, 102 (05): : 620 - 620
  • [26] On hydro-thermal stresses of plastic IC packages
    Su, F
    Chian, KS
    Yi, S
    2004 4TH IEEE INTERNATIONAL CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, 2004, : 85 - 88
  • [27] Thermal model reduction for IC packages and MCM's
    Furmanczyk, M
    Napieralski, A
    Yu, E
    Przekwas, A
    Turowski, M
    THERMINIC: COLLECTION OF PAPERS PRESENTED AT THE INTERNATIONAL WORKSOP ON THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES, 1998, : 135 - 138
  • [28] THERMAL DEVELOPMENT OF HEAT PIPE COOLED IC PACKAGES
    CORMAN, JC
    MCLAUGHL.MH
    MECHANICAL ENGINEERING, 1973, 95 (06) : 59 - 60
  • [29] Modelling of IC-packages based on thermal characteristics
    Ewes, I
    THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II, 1997, : 149 - 158
  • [30] Phase change materials for thermal management of IC packages
    Behunek, Ivo
    Fiala, Pavel
    RADIOENGINEERING, 2007, 16 (02) : 50 - 55
12345