Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

被引：8
作者：
Zaal, Jeroen J. M. [1 ]
van Driel, Willem D. [1 ]
Zhang, G. Q. [1 ]
机构：
[1] Delft Univ Technol, Dept PME, NL-2628 CD Delft, Netherlands
来源：
SENSORS | 2010年 / 10卷 / 04期
关键词：
MEMS; wafer level thin film package; packaging; resonator; ENCAPSULATION TECHNOLOGY; DIAMOND; SILICON;
D O I：
10.3390/s100403989
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.
引用
收藏
页码：3989 / 4001
页数：13
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