Transient liquid phase (TLP) bonding of Al7075 to Ti-6Al-4V alloy

被引：89

作者：

AlHazaa, A. ^{[1
]}

Khan, T. I. ^{[1
]}

Haq, I. ^{[1
]}

机构：

[1] Univ Calgary, Schulich Sch Engn, Dept Mech & Mfg Engn, Calgary, AB T2N 1N4, Canada

来源：

MATERIALS CHARACTERIZATION | 2010年 / 61卷 / 03期

基金：

加拿大自然科学与工程研究理事会;

关键词：

Aerospace alloys; Eutectic; Interlayers; Microstructure; TLP bonding; Grains; AL-CU; DIFFUSION; TITANIUM;

D O I：

10.1016/j.matchar.2009.12.014

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

TLP diffusion bonding of two dissimilar aerospace alloys, Ti-6Al-4V and Al7075, was carried out at 500 degrees C using 22 gm thick Cu interlayers for various bonding times. Joint formation was attributed to the solid-state diffusion of Cu into the Ti alloy and Al7075 alloy followed by eutectic formation and isothermal solidification along the Cu/Al7075 interface. Examination of the joint region using SEM, EDS and XPS showed the formation of eutectic phases such as, theta(Al2Cu), T(Al2Mg3Zn3) and Al13Fe along grain boundaries within the Al7075 matrix. At the Cu/Ti alloy bond interface a solid-state bond formed resulting in a Cu3Ti2 phase formation along this interface. The joint region homogenized with increasing bonding time and gave the highest bond strength of 19.5 MPa after a bonding time of 30 mm. (C) 2010 Elsevier Inc. All rights reserved.

引用

页码：312 / 317

页数：6

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