Mechanism of dissolution of a Cu-13Sn alloy in low aggressive conditions

被引：56

作者：

Mabille, I ^{[1
]}

Bertrand, A ^{[1
]}

Sutter, EMM ^{[1
]}

Fiaud, C ^{[1
]}

机构：

[1] UPMC, ENSCP, Lab Genie Procedes Plasmas & Traitements Surface, UPRES 287, F-75231 Paris 05, France

来源：

CORROSION SCIENCE | 2003年 / 45卷 / 05期

关键词：

copper-tin alloy; scanning electron microscopy; chronoamperometry; de-alloying; passive films;

D O I：

10.1016/S0010-938X(02)00207-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Corrosion of a synthetic Cu-13Sn alloy with a dendritic structure was investigated in a low aggressive medium (0.01 M Na2SO4 aqueous solution). The corrosion rate was accelerated through anodic polarization of the alloy in a potential range close to the open-circuit potential. The composition of the corrosion layer was followed as a function of the polarization time, using scanning electron microscopy and energy dispersive spectrometry methods. The results clearly showed that bronze corrosion in these experimental conditions proceeds by decuprification. Selective copper dissolution leads to corrosion layers enriched in tin compounds. It was concluded that bronze is partially passivated through the presence of a tin oxide layer, which slows down copper dissolution rate, compared to pure copper. (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：855 / 866

页数：12

共 19 条

[1] Characterization of the oxide layers on a Cu-13Sn alloy in a NaCl aqueous solution without and with 0.1 M benzotriazole. Electrochemical and photoelectrochemical contributions [J].