The introduction of MEMS packaging technology

被引:7
|
作者
Hsieh, CT [1 ]
Ting, JM [1 ]
Yang, C [1 ]
Chung, CK [1 ]
机构
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源
PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING | 2002年
关键词
MEMS; MEMS packaging; IC Package; LTCC; Wafer Level; stiction;
D O I
10.1109/EMAP.2002.1188855
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In modem consumer electronic devices, not only the weightless and small-sized but also the multi-function specifications are required. The devices made by MEMS technology have become the major tendency of the products because they consist the above characters. Involving the electronics, optoelectronics, information - mechanics - materials - biochemistry and control technologies, the MEMS techniques is the most potential science and will have great influence on human life in the twenty first century. The packaging technique is the key point in the MEMS devices, so it is necessary to study the techniques and the materials for the MEMS packing. In this study, the MEMS packaging techniques, including the packaging types and functions would be introduced.
引用
收藏
页码:300 / 306
页数:7
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