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- [31] Reliability assessment of delamination in chip-to-chip bonded MEMS packaging IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (02): : 141 - 151
- [32] MEMS packaging: State of the art and future trends SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS, 1998, 3328 : 166 - 173
- [33] Measurement of Leak Rate for MEMS Vacuum Packaging JOURNAL OF ELECTRONIC PACKAGING, 2009, 131 (04) : 0410011 - 0410016
- [34] Packaging of a MEMS based safety and arming device ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS, 2000, : 107 - 112
- [37] Ceramic packaging for MEMS-based microsystems CERAMIC INTERCONNECT TECHNOLOGY: NEXT GENERATION, 2003, 5231 : 229 - 234
- [38] Wafer level packaging for MEMS Geiger counter PROCEEDINGS OF THE 2012 FIFTH INTERNATIONAL CONFERENCE ON EMERGING TRENDS IN ENGINEERING AND TECHNOLOGY (ICETET 2012), 2012, : 66 - 69
- [39] Investigation of packaging structure for MEMS phase shifters J. Shanghai Jiaotong Univ. Sci., 2008, SUPPL. (27-30): : 27 - 30