共 50 条
- [1] Packaging technology in MEMS ISTM/2003: 5TH INTERNATIONAL SYMPOSIUM ON TEST AND MEASUREMENT, VOLS 1-6, CONFERENCE PROCEEDINGS, 2003, : 175 - 178
- [3] Thick resist alignment technology for MEMS and advanced packaging EMERGING LITHOGRAPHIC TECHNOLOGIES VII, PTS 1 AND 2, 2003, 5037 : 1059 - 1065
- [4] MEMS sensor packaging using LTCC substrate technology DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS II, 2001, 4592 : 148 - 158
- [5] A generic environment-resistant packaging technology for MEMS TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2007,
- [6] Through silicon vies (TSVs) technology for MEMS Packaging MATERIALS PROCESSING TECHNOLOGIES, PTS 1 AND 2, 2011, 154-155 : 1695 - 1698
- [8] MEMS packaging issues and materials 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 598 - 604
- [9] Cu/Sn isothermal solidification technology for hermetic packaging of MEMS 2006 1ST IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3, 2006, : 1133 - +