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Capsule-Based dry powder inhaler evaluation using CFD-DEM simulations and next generation impactor data
被引:12
|作者:
Almeida, Lucilla C.
[1
]
Bharadwaj, Rahul
[1
]
Eliahu, Avi
[2
]
Wassgren, Carl R.
[3
]
Nagapudi, Karthik
[4
]
Muliadi, Ariel R.
[4
]
机构:
[1] Engn Simulat & Sci Software, Rua Orlando Phillipi 100, BR-88032700 Florianopolis, SC, Brazil
[2] Genentech Inc, Device Dev, 1 DNA Way, South San Francisco, CA 94080 USA
[3] Purdue Univ, Sch Mech Engn, 585 Purdue Mall, W Lafayette, IN 47907 USA
[4] Genentech Inc, Small Mol Pharmaceut, Res & Early Dev gRED, 1 DNA Way, South San Francisco, CA 94080 USA
关键词:
CFD-DEM;
Dry powder inhalers;
Discrete element method;
Computational fluid dynamics;
Inhalation drug delivery;
COMPUTATIONAL FLUID-DYNAMICS;
OROPHARYNGEAL DEPOSITION;
PHARMACEUTICAL IMPACTOR;
PARTICLE-SIZE;
DEVICE DESIGN;
PERFORMANCE;
COMPARABILITY;
FORMULATION;
MODEL;
FLOW;
D O I:
10.1016/j.ejps.2022.106226
中图分类号:
R9 [药学];
学科分类号:
1007 ;
摘要:
Capsule-based, single-dose dry powder inhalers (DPIs) are commonly-used devices to deliver medications to the lungs. This work evaluates the effect of the drug/excipient adhesive bonding and the DPI resistances on the aerosol performance using a combination of empirical multi-stage impactor data and a fully-coupled computational fluid dynamics (CFD) and discrete element method (DEM) model. Model-predicted quantities show that the primary modes of powder dispersion are a function of the device resistance. Lowering the device resistance increases its capacity to transport a wider range of particle size classes toward the outlet and generate more intense turbulence upstream therein. On the other hand, a higher device resistance increases the velocity of the tangential airflow along the device walls, which in turn increases the intensity of particle/device impaction. Correlating model data and experimental results shows that these differing powder dispersion mechanisms affect different formulations differently, with finer aerosols tending to result when pairing a lower resistance device with formulations that exhibit low API/excipient adhesion, or when pairing a high resistance device with more cohesive formulations.
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页数:19
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