High-Temperature Joining of Low-Temperature Co-Fired Ceramics

被引:0
作者
Walker, C. A. [1 ]
Uribe, F. [1 ]
Monroe, S. L. [1 ]
Stephens, J. J. [1 ]
Goeke, R. S. [1 ]
Hodges, V. C. [1 ]
机构
[1] Sandia Natl Labs, Albuquerque, NM 87185 USA
来源
BRAZING AND SOLDERING, PROCEEDINGS | 2006年
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Experiments were run in which various compositions of low temperature co-fired ceramic (LTCC) sections were brazed to Kovar (TM) (Fe-29Ni-17Co) metal sections in inert gas atmospheres using silver-based braze filler metals at temperatures up to 755C in an attempt to identify optimum processing conditions. The tensile buttons fabricated were similar to standard ASTM-F19 samples except that the metal and non-metal positions were reversed. Therefore, in the brazed assemblies the LTCC was brazed between two metal tensile button halves. Brazed in this unique manner, the tensile buttons assemblies more accurately represented the actual component. Thin-film metallization schemes were varied, along with thermal processing parameters. The brazed assemblies were subsequently helium leak checked and tested for tensile strength at room temperature. Results of trials with varying filler metals, thermal profiles parameters will be discussed and compared to results obtained using alumina ceramics. Hermetic samples (helium leak rates < 1.0E-09 atm-cc/sec) were made with all three types of LTCC used in the study. The average strengths for the three types of LTCC varied from 3300 psi to 8000psi compared to 12300 psi achieved using high-temperature (alumina) ceramic. In general, thin-films with platinum outer layers outperformed thin-films with outer layers of gold or palladium in both hermeticity testing and tensile strength.
引用
收藏
页码:54 / 59
页数:6
相关论文
共 13 条
[1]  
*ASM INT, 1986, BIN ALL PHAS DIAGR, V2
[2]  
FAN W, 6 EL PACK TECHN C P, P76
[3]  
HANDA T, 1993, IEEE CHMT EUR INT EL, P147
[4]  
KEUSSEYAN R, 2002 EL COMP TECHN C, P259
[5]  
KEUSSEYAN RL, 1990, 8TH IEMT 1990 : INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM, P186, DOI 10.1109/IEMT8.1990.171103
[6]  
KEUSSEYAN RL, EL COMP TECHN C 2003, P896
[7]  
KOVACS AL, 1994, P 1994 INT C MULT MO, P591
[8]  
OKAMOTO N, P IEEE CPMT INT EL M, P40
[9]  
URIBE F, 1997, SAND970497 SAND NAT
[10]  
2001, 951 GREEN TAPE THICK