Three dimensional finite element simulation of wire looping process in wirebonding

被引：0

作者：

Ng, BH ^{[1
]}

Tay, AAO ^{[1
]}

Ong, SH ^{[1
]}

机构：

[1] Natl Univ Singapore, Ctr IC Failure Anal & Reliabil, Singapore 117548, Singapore

来源：

PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002) | 2002年

关键词：

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper describes a fully three-dimensional finite element simulation of the wirelooping process in ball-wedge wirebonding. The three-dimensional geometry of the wirebonder capilliary is utilised and the free interaction between the capilliary and the wire simulated. The effect of wire-tensioning is studied and the "kick up" effect of the wedge bonding process was simulated. Good agreement between simulated and actual wirebond profiles is obtained.

引用

页码：334 / 337

页数：4