Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

被引：21
作者：
Zeng, Qiulian [1 ,2 ]
Guo, Jianjun [1 ]
Gu, Xiaolong [1 ]
Zhao, Xinbing [2 ]
Liu, Xiaogang [1 ]
机构：
[1] Zhejiang Met Res Inst, Zhejiang Prov Key Lab Soldering & Brazing Mat & T, Hangzhou 310011, Zhejiang, Peoples R China
[2] Zhejiang Univ, Dept Mat Sci & Engn, Hangzhou 310027, Zhejiang, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY | 2010年 / 26卷 / 02期
关键词：
Wetting; Interfacial reaction; High temperature lead-free solder; Sn-10Sb-5Cu solder; SN-5-PERCENT-SB SOLDER; PHASE-EQUILIBRIA; CREEP-BEHAVIOR; THIN-FILMS; ABI TESTS; ALLOY; DEFORMATION; TENSILE; SOLDERABILITY; PREDICTION;
D O I：
10.1016/S1005-0302(10)60026-6
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400 degrees C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360 degrees C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.
引用
收藏
页码：156 / 162
页数：7
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