共 7 条
- [2] The serving behavior of nanotwinned copper under the reliability test of high temperature high humidity and electromigration test 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [3] Prognostication of Copper-Aluminum Wirebond Reliability under High Temperature Storage and Temperature-Humidity 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1973 - 1985
- [4] To develop reliability life model for organic light emitting diodes operating under high temperature environment PROCEEDINGS OF THE 11TH INTERNATIONAL CONFERENCE ON INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT, VOLS 1 AND 2: INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT IN THE GLOBAL ECONOMY, 2005, : 52 - 55
- [5] Microstructural Indicators for Prognostication of Copper-Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (04): : 569 - 585
- [6] Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates Metals and Materials International, 2014, 20 : 367 - 373