VISUAL AND COGNITIVE ANALYSIS OF MULTIVARIATE DATA FOR CHARACTERIZING AL/SIC METAL MATRIX COMPOSITES

被引:1
作者
Pak, Alexander Ya [1 ]
Zakharova, Alyona A. [1 ]
Shklyar, Alexei, V [1 ]
Pak, Tatyana A. [1 ]
机构
[1] Natl Res Tomsk Polytech Univ, Tomsk, Russia
来源
LIGHT & ENGINEERING | 2019年 / 27卷 / 05期
基金
俄罗斯科学基金会;
关键词
literature review; data collection; data systematization; multivariate data; visual and cognitive model; heat-transmitting element of the light device; Al/SiC MMC; properties; obtaining methods; conditions; THERMOPHYSICAL PROPERTIES; THERMAL-PROPERTIES;
D O I
10.33383/2018-068
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The work shows the results of the literature review of the methods for obtaining aluminium-silicon carbide - metal matrix composites (Al/SiC MMCs). This work also includes the collection, analysis, and systemization of the literature data where textual information is presented as a single lexical and semantic system and where numeral information is presented as a dimensional system. The analysis of the literature data was conducted by visual and cognitive modelling, so that methods of forming Al/SiC MMCs and operating parameters that provide the best properties of the material (maximum level of thermal conductivity and minimum level of thermal linear expansion) are determined. Compared to the literature data, the data are presented that were received in a series of tests for obtaining Al/SiC MMCs with spark plasma sintering from SiC, which was synthesized in atmospheric electric arc plasma. Within the framework of the given subject, the authors do not know any analogues of such an analysis and visualization system that allows us to analyse multivariate data, which is essential for solving issues of finding a correlation for the variety of initial parameters that characterize the process of obtaining Al/SiC MMCs and that characterize the cluster of properties for the obtained material. The comparison data are given for thermal conductivity levels of modern (aluminium) LED light devices and Al/SiC MMC samples.
引用
收藏
页码:72 / 81
页数:10
相关论文
共 23 条
  • [1] Optimization of the thermal distribution of multi-chip LED package
    Ben Abdelmlek, K.
    Araoud, Z.
    Charrada, K.
    Zissis, G.
    [J]. APPLIED THERMAL ENGINEERING, 2017, 126 : 653 - 660
  • [2] Chu K, 2010, COMPOS PART A-APPL S, P161
  • [3] Thermal conductivity of Al-SiCp composites by plasma spraying
    Gui, MC
    Kang, SB
    Euh, K
    [J]. SCRIPTA MATERIALIA, 2005, 52 (01) : 51 - 56
  • [4] Microstructure and thermophysical properties of SiC/Al composites mixed with diamond
    Guo, Hong
    Han, Yuan-yuan
    Zhang, Xi-min
    Jia, Cheng-chang
    Xu, Jun
    [J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2015, 25 (01) : 170 - 174
  • [5] Kablov E.N., 2011, J LOBACHEVSKY STATE, V3, P56
  • [6] Konovalov A.V., 2015, STRUCTURES COMPOSITE, V1, P30
  • [7] Pressure infiltration casting process and thermophysical properties of high volume fraction SiCp/Al metal matrix composites
    Lee, HS
    Hong, SH
    [J]. MATERIALS SCIENCE AND TECHNOLOGY, 2003, 19 (08) : 1057 - 1064
  • [8] Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications
    Lee, HS
    Jeon, KY
    Kim, HY
    Hong, SH
    [J]. JOURNAL OF MATERIALS SCIENCE, 2000, 35 (24) : 6231 - 6236
  • [9] Thermophysical properties of SiC/Al composites with three dimensional interpenetrating network structure
    Li, Shun
    Xiong, Degan
    Liu, Meng
    Bai, Shuxin
    Zhao, Xun
    [J]. CERAMICS INTERNATIONAL, 2014, 40 (05) : 7539 - 7544
  • [10] Liu Junwu, 2008, J ALLOY COMPD, P239