Modeling and parameter extraction methods of bond-wires for chip-package co-design

被引：0
|
作者：
Jing, Weiping [1 ]
Sun, Ling [1 ]
Sun, Haiyan [1 ]
机构：
[1] Nantong Univ, Jiangsu Provincial Key Lab ASIC Design, No 40 Qingnian Rd E, Nantong, Peoples R China
来源：
ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The objective of this paper was to present a preparatory investigation of modeling of IC packages for chip-package co-design. Our work was focused on the modeling and Parameter extraction methods of bond-wires. Based on two-port parameters, a lumped II-type equivalent circuit for a single-bond-wire was presented and the R, L, and C parameters of the bond-wire were extracted. In addition, multi-bond-wires were proposed for better performance by comparing their simulated S-parameters with measured results. Finally, a simple and low cost test structure was designed and made for validation of the parameterized model.
引用
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页码：173 / +
页数：2
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