THERMODYNAMIC PROPERTIES OF THE LIQUID Ag-Bi-Cu-Sn LEAD-FREE SOLDER ALLOYS

被引：4

作者：

Garzel, G. ^{[1
]}

Kopyto, M. ^{[1
]}

Zabdyr, L. A. ^{[1
]}

机构：

[1] Polish Acad Sci, Inst Met & Mat Sci, Lab Phys Chem Mat, Krakow, Poland

来源：

JOURNAL OF MINING AND METALLURGY SECTION B-METALLURGY | 2014年 / 50卷 / 02期

关键词：

Electrochemical techniques; Thermodynamic properties; Lead-free solders; PHASE-EQUILIBRIA; TERNARY-SYSTEM;

D O I：

10.2298/JMMB130727015G

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

THERMODYNAMIC PROPERTIES OF THE LIQUID Ag-Bi-Cu-Sn LEAD-FREE SOLDER ALLOYS G. Garzel, M.Kopyto, L. A. Zabdyr Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Laboratory of Physical Chemistry of Materials, Krakow, Poland (Received 27 July 2013; accepted 02 April 2014) The electromotive force measurement method was employed to determine the thermodynamic properties of liquid Ag-Bi-Cu-Sn alloys using solid electrolyte galvanic cells as shown below: Kanthal+Re, Ag-Bi-Cu-Sn, SnO2 vertical bar Yttria Stabilized Zirconia vertical bar air, Pt, Experiments were made within temperature interval: 950-1300K along four composition paths of constant ratios: [GRAPHICS] and tin concentration changing from 0.110 0.9 mole fractions, every 0.1. Atmost all the results were approximated by straight line equations: EMF vs T, and tin activities were then calculated in arbitrary temperature; measurement results were presented by graphs. Unusual activity plot for X-B1: (X-Ag + X-Cu) = 3:2 composition path was most probably caused by miscibility gap detected earlier in Bi-Cu-Sn ternary liquid alloys.

引用

页码：145 / 148

页数：4

共 22 条

[1]

[Anonymous], 2008, SOLDERS DATABASE LEA

[2]

Dinsdale A.T., 2008, 531 COST

[3] Thermodynamic study of the phase equilibria in the Sn-Ag-Bi-Cu quaternary system [J].

Doi, K ;

Ohtani, H ;

Hasebe, M .

MATERIALS TRANSACTIONS, 2004, 45 (02) :380-383

[4] Thermal analysis and microstructure of the as-cast Ag-Bi-Cu alloys [J].

Fima, Przemyslaw ;

Garzel, Grzegorz .

CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 2014, 44 :48-53

[5] Enthalpies of mixing of liquid Bi-Cu and Bi-Cu-Sn alloys relevant for lead-free soldering [J].

Flandorfer, Hans ;

Sabbar, Abdelaziz ;

Luef, Christoph ;

Rechchach, Meryem ;

Ipser, Herbert .

THERMOCHIMICA ACTA, 2008, 472 (1-2) :1-10

[6] Electromotive force study of the liquid silver-bismuth-tin alloys [J].

Garzel, G ;

Zabdyr, LA .

JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2006, 27 (02) :140-144

[7] Thermodynamic properties of liquid Au-Bi-Sn alloys [J].

Guo, Zhongnan ;

Yuan, Wenxia ;

Hindler, Michael ;

Mikula, Adolf .

JOURNAL OF CHEMICAL THERMODYNAMICS, 2012, 48 :201-206

[8] Thermodynamics and phase diagrams of lead-free solder materials [J].

Ipser, H. ;

Flandorfer, H. ;

Luef, Ch. ;

Schmetterer, C. ;

Saeed, U. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :3-17

[9] THERMODYNAMIC PROPERTIES OF THE LIQUID Bi-Cu-Sn LEAD-FREE SOLDER ALLOYS [J].

Kopyto, M. ;

Garzel, G. ;

Zabdyr, L. A. .

JOURNAL OF MINING AND METALLURGY SECTION B-METALLURGY, 2009, 45 (01) :95-100

[10] Thermodynamic properties of the liquid Ag-Cu-Sn lead-free solder alloys [J].

Kopyto, Marek ;

Onderka, Boguslaw ;

Zabdyr, Leszek A. .

MATERIALS CHEMISTRY AND PHYSICS, 2010, 122 (2-3) :480-484

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