共 50 条
- [1] Towards 3D optical integration by micro-transfer printing of ultra-thin membrane devices 2018 IEEE BRITISH AND IRISH CONFERENCE ON OPTICS AND PHOTONICS (BICOP), 2018, : 124 - 127
- [2] Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1789 - 1795
- [3] A new ultra-thin 3D integration technique: Technological and thermal investigations DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS, PROCEEDINGS, 2000, 4019 : 324 - 332
- [4] Novel IR Laser Cleaving for ultra-thin Layer Transfer and 3D Stacked Devices 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1749 - 1753
- [7] Ultra-thin sensor array for 3D curvature sensing SMART SENSOR PHENOMENA, TECHNOLOGY, NETWORKS, AND SYSTEMS INTEGRATION 2015, 2015, 9436
- [8] Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers. EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1301 - +
- [9] Ultra-thin Capacitors in Silicon for 3D-Integration and Flexible Electronics 2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC), 2019,