Measurement of deformation and strain in flip chip on BGA (FC-BGA)

被引：5

作者：

Kehoe, L ^{[1
]}

Guénebaut, V ^{[1
]}

Kelly, PV ^{[1
]}

机构：

[1] Opt Metrol Innovat Ltd, Cork, Ireland

来源：

54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年

关键词：

D O I：

10.1109/ECTC.2004.1319324

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An autofocus Digital Image Correlation (DIC) workstation incorporating image stacking functionality was used to perform a thermo-mechanical deformation and strain analysis of controlled collapse chip connect (C4) bumps in two FC-BGA packages. Cross-sections through C4 bumped region were analysed through a temperature cycle from ambient temperature up to 100degreesC. Strain concentrations at the C4 layer-to-die interface are revealed. Aspects of recent advances in digital image correlation technology are described in the context of this study.

引用

页码：120 / 127

页数：8

共 4 条

[1] Verification of numerical models used in microelectronics packaging design by interferometric displacement measurement methods [J].