Feature profile simulation of silicon nitride atomic layer deposition

被引:7
作者
Moroz, Paul [1 ]
Moroz, Daniel J. [2 ]
机构
[1] Amer LLC, TEL Technol Ctr, US TDC, Billerica, MA 01821 USA
[2] Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA
关键词
INDUCTIVELY-COUPLED CL-2; SCALE CELLULAR-MODEL; ETCHING PROCESSES; HBR DISCHARGES; EVOLUTION; PLASMA; POLYSILICON; LITHOGRAPHY; FABRICATION; REFLECTION;
D O I
10.7567/JJAP.56.06HE07
中图分类号
O59 [应用物理学];
学科分类号
摘要
We perform feature-scale numerical simulations with the FPS3D software package to model the atomic layer deposition of silicon nitride using cycles of hexachlorodisilane and hydrazine. Whenever available, the results of simulations are compared with the published experimental data. These simulations emphasize the power of a feature-scale approach, which is effective even for atomic layer deposition, a delicate method of materials processing. We demonstrate reasonably good agreement with the results of experiments. Based on simulations, we suggest some explanations of important phenomena such as the increase in surface roughness as the number of processing cycles increases, the rounded corners of deposited film, the small amount of impurities in the film comprised of elements of the processing gases, and the observation that typically less than a full monolayer of film is deposited per cycle. (C) 2017 The Japan Society of Applied Physics
引用
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页数:8
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共 45 条
[1]   SIMULATION OF SURFACE-TOPOGRAPHY EVOLUTION DURING PLASMA-ETCHING BY THE METHOD OF CHARACTERISTICS [J].
ARNOLD, JC ;
SAWIN, HH ;
DALVIE, M ;
HAMAGUCHI, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (03) :620-635
[2]   Integrated nanoelectronics for the future [J].
Chau, Robert ;
Doyle, Brian ;
Datta, Suman ;
Kavalieros, Jack ;
Zhang, Kevin .
NATURE MATERIALS, 2007, 6 (11) :810-812
[3]   Atomic-scale simulation of ALD chemistry [J].
Elliott, Simon D. .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2012, 27 (07)
[4]   Atomic Layer Deposition: An Overview [J].
George, Steven M. .
CHEMICAL REVIEWS, 2010, 110 (01) :111-131
[5]   Atomic layer controlled deposition of silicon nitride with self-limiting mechanism [J].
Goto, H ;
Shibahara, K ;
Yokoyama, S .
APPLIED PHYSICS LETTERS, 1996, 68 (23) :3257-3259
[6]   Mixing-layer kinetics model for plasma etching and the cellular realization in three-dimensional profile simulator [J].
Guo, Wei ;
Bai, Bo ;
Sawin, Herbert H. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2009, 27 (02) :388-403
[7]   A SHOCK-TRACKING ALGORITHM FOR SURFACE EVOLUTION UNDER REACTIVE-ION ETCHING [J].
HAMAGUCHI, S ;
DALVIE, M ;
FAROUKI, RT ;
SETHURAMAN, S .
JOURNAL OF APPLIED PHYSICS, 1993, 74 (08) :5172-5184
[8]   Microtrenching resulting from specular reflection during chlorine etching of silicon [J].
Hoekstra, RJ ;
Kushner, MJ ;
Sukharev, V ;
Schoenborn, P .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (04) :2102-2104
[9]   Integrated plasma equipment model for polysilicon etch profiles in an inductively coupled plasma reactor with subwafer and superwafer topography [J].
Hoekstra, RJ ;
Grapperhaus, MJ ;
Kushner, MJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1997, 15 (04) :1913-1921
[10]   Molecular dynamics simulation of the Al2O3 film structure during atomic layer deposition [J].
Hu, Zheng ;
Shi, Junxia ;
Heath Turner, C. .
MOLECULAR SIMULATION, 2009, 35 (04) :270-279