Surface current modelling of the skin effect for on-chip interconnections

被引:21
作者
De Zutter, Daniel [1 ]
Rogier, Hendrik
Knockaert, Luc
Sercu, Jeannick
机构
[1] Univ Ghent, Dept Informat Technol, B-9000 Ghent, Belgium
[2] Agilent Technol, B-9051 Ghent, Belgium
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2007年 / 30卷 / 02期
关键词
on-chip interconnect; resistance and inductance matrices; skin effect; surface impedance/admittane;
D O I
10.1109/TADVP.2007.895984
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, the skin effect for 2-D on-chip interconnections is predicted using a recently developed differential surface admittance concept. First, the features of the new approach are briefly recapitulated and details are given for a conductor with rectangular cross-section. Next, the 1-D situation is studied as a limiting case of the 2-D situation. The relationship with a local impedance formulation is investigated and illustrated with a numerical example. Finally, the new method is used to determine inductance and resistance matrices of 2-D on-chip interconnect examples with specifications taken from the International Technology Roadmap for Semiconductors. Extra capacitance data are also provided.
引用
收藏
页码:342 / 349
页数:8
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