Flexible Film Systems: Current Understanding and Future Prospects

被引：21
作者：
Cordill, Megan J. [1 ,2 ]
机构：
[1] Univ Leoben, Erich Schmid Inst Mat Sci, Austrian Acad Sci, Leoben, Austria
[2] Univ Leoben, Dept Mat Phys, Leoben, Austria
来源：
JOM | 2010年 / 62卷 / 06期
关键词：
THIN COPPER-FILMS; MECHANICAL-PROPERTIES; IN-SITU; TENSILE PROPERTIES; YIELD STRENGTH; METAL-FILMS; STRAIN; CU; FRAGMENTATION; DEFORMATION;
D O I：
10.1007/s11837-010-0096-5
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The electrical and mechanical properties of metal films on polymer substrates are of interest for use in flexible electronic devices and sensors. In these systems, film deformation mechanisms are comparable to those from freestanding films but the influence of the substrate and the interface on the film properties is yet to be fully understood. This understanding is critical to further design improvements and advanced in situ characterization holds the promise of making this possible. With the aid of such techniques direct observation of failure and deformation mechanisms has become possible.
引用
收藏
页码：9 / 14
页数：6
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