INVESTIGATION OF MULTICOMPONENT LEAD-FREE SOLDERS

被引：4

作者：

Gyenes, A. ^{[1
]}

Benke, M. ^{[1
]}

Teglas, N. ^{[1
]}

Nagy, E. ^{[2
]}

Gacsi, Z. ^{[1
]}

机构：

[1] Univ Miskolc, Inst Phys Met Met Forming & Nanotechnol, B1-109, H-3515 Miskolc, Hungary

[2] Univ Miskolc, MTA ME Mat Sci Res Grp, H-3515 Miskolc, Hungary

来源：

ARCHIVES OF METALLURGY AND MATERIALS | 2017年 / 62卷 / 02期

关键词：

lead-free solder; multicomponent; microstructure; X-ray diffraction; mechanical properties;

D O I：

10.1515/amm-2017-0156

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

According to the directives (RoHS and WEEE) adopted by the European Union, lead has been banned from the manufacturing processes because of its health and environmental hazards. Therefore, the development of lead-free solders is one of the most important research areas of the electronic industry. This paper investigates multicomponent Sn-Ag-Cu based lead-free solders with different compositions. The properties of the six-component Innolot (SAC+ BiSbNi) and two low-Ag containing alloys were compared with the widespread used SAC307 solder. Microstructure investigations and X-ray diffraction measurements were performed to analyze and identify the formed phases, furthermore, tensile tests and microhardness measurements were executed to determine the mechanical properties of the examined solders.

引用

页码：1071 / 1074

页数：4