Deep trench isolation for crosstalk suppression in active pixel sensors with 1.7 μm pixel pitch

被引:40
作者
Park, Byung Jun [1 ]
Jung, Jongwan [1 ]
Moon, Chang-Rok [1 ]
Hwang, Sung Ho [1 ]
Lee, Yong Woo [1 ]
Kim, Dae Woong [1 ]
Paik, Kee Hyun [1 ]
Yoo, Jong Ryeol [1 ]
Lee, Duck Hyung [1 ]
Kim, Kinam [1 ]
机构
[1] Samsung Elect Co Ltd, Semicond Res Ctr, Memory Div, Yongin 449711, South Korea
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2007年 / 46卷 / 4B期
关键词
image sensors; CMOS image sensors; deep trench isolation (DTI); crosstalk; white spot; sensitivity;
D O I
10.1143/JJAP.46.2454
中图分类号
O59 [应用物理学];
学科分类号
摘要
A deep trench isolation (DTI) process with a 4 mu m deep trench has been developed and successfully applied to 5-megapixel complementary metal oxide silicon (CMOS) image sensors with a 1.7 mu m pixel pitch. It was found that from the results of simulations and experiments, DTI is very effective for reducing electrical crosstalk without degrading other pixel characteristics, such as full well capacity, sensitivity, and white spot density. Therefore, DTI could be a solution for obtaining a high performance for CMOS image sensors with a small pixel size of sub-2.0 mu m.
引用
收藏
页码:2454 / 2457
页数:4
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