Applying computational nanomaterials design to the reactive ion etching of NiO thin films -: a preliminary investigation

被引:10
作者
David, M. [1 ]
Muhida, R.
Roman, T.
Kunikata, S.
Dino, Wa
Nakanishi, H.
Kasai, H.
Takano, F.
Shima, H.
Akinaga, H.
机构
[1] Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan
[2] Osaka Univ, Ctr Promot Res Nanosci & Nanotechnol, Toyonaka, Osaka 5608531, Japan
关键词
Computational methods - Hydrogen - Methane - Nickel oxide - Reactive ion etching;
D O I
10.1088/0953-8984/19/36/365210
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
We have developed and proposed a model for reactive ion etching (RIE) process design of nickel oxide thin films using a computational materials design based on ab initio calculations. On etching NiO, we found that it was necessary to have hydrogen-based reactive gases in the initial state in order to enhance RIE (e. g. NH3, CH4). We strongly suggest the use of CH4 or any H-based gas source other than CHF3 to enhance RIE process.
引用
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页数:7
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