Design of Substrate Integrated Coaxial Line under Silicon-based MEMS Process

被引：1

作者：

Dong, Keyu ^{[1
]}

Li, Xiaochun ^{[1
]}

Ning, Ken ^{[1
]}

Shao, Yan ^{[1
]}

Mao, Junfa ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Minist Educ Design & Electromagnet Compatibil Hig, Key Lab, Shanghai, Peoples R China

来源：

2019 IEEE MTT-S INTERNATIONAL WIRELESS SYMPOSIUM (IWS 2019) | 2019年

基金：

中国国家自然科学基金;

关键词：

Substrate integrated coaxial line; MEMS; transition; impedance matching;

D O I：

10.1109/ieee-iws.2019.8803877

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Substrate integrated coaxial line (SICL) has wideband and low loss features due to its quasi-closed structure. In this paper, a 50 Omega SICL-based interconnect with its quasi-coaxial transition is designed and fabricated under silicon-based MEMS process. Due to impedance discontinuity between the SICL and its transition, step impedance matching circuit is introduced for low reflection loss. The measurement results show that 3 dB bandwidth of the SICL interconnect is 77 GHz. Compared with those under other processes, the SICL fabricated under MEMS process has wider bandwidth and lower loss and hence it can be applied in high-speed system in packages (SIPs) and integrated circuits (ICs).

引用

页数：3

共 8 条

[1] High-Performance Coplanar Waveguide to Empty Substrate Integrated Coaxial Line Transition [J].

Belenguer, Angel ;

Borja, Alejandro L. ;

Esteban, Hector ;

Boria, Vicente E. .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2015, 63 (12) :4027-4034

[2] High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications [J].

Decrossas, Emmanuel ;

Glover, Michael D. ;

Porter, Kaoru ;

Cannon, Tom ;

Stegeman, Thomas ;

Allen-McCormack, Nicholas ;

Hamilton, Michael C. ;

Mantooth, H. Alan .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (03) :307-313

[3]

Gatti F, 2006, 2006 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-4, P1606

[4]

Hong J. S., 2004, Microstrip Filter for RF/Microwave Applications

[5]

Paul C. R., 2008, ANALAYSIS MILTICONDU

[6] A Wideband Millimeter-Wave Substrate Integrated Coaxial Line Array for High-Speed Data Transmission [J].

Shao, Yan ;

Li, Xiao-Chun ;

Wu, Lin-Sheng ;

Mao, Jun-Fa .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2017, 65 (08) :2789-2800

[7] High performances of shielded LTCC vertical transitions from DC up to 50 GHz [J].

Valois, R ;

Baillargeat, D ;

Verdeyme, S ;

Lahti, M ;

Jaakola, T .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2005, 53 (06) :2026-2032

[8] A Three-Dimensional Cooperative Guidance Law of Multimissile System [J].

Wei, Xing ;

Wang, Yongji ;

Dong, Shuai ;

Liu, Lei .

INTERNATIONAL JOURNAL OF AEROSPACE ENGINEERING, 2015, 2015

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