Bending behaviors and fracture characteristics of laminated ductile-tough composites under different modes

被引：78
作者：
Liu, B. X. [1 ,2 ,3 ]
Huang, L. J. [1 ]
Rong, X. D. [1 ]
Geng, L. [1 ]
Yin, F. X. [2 ,3 ]
机构：
[1] Harbin Inst Technol, Sch Mat Sci & Engn, POB 433, Harbin 150001, Peoples R China
[2] Hebei Univ Technol, Res Inst Energy Equipment Mat, Tianjin 300132, Peoples R China
[3] Tianjin Key Lab Mat Laminating Fabricat & Interfa, Tianjin, Peoples R China
来源：
COMPOSITES SCIENCE AND TECHNOLOGY | 2016年 / 126卷
基金：
中国国家自然科学基金;
关键词：
Layered structures; Fracture; Damage mechanics; Scanning electron microscopy (SEM); Welding/joining; TI-TIBW/TI COMPOSITES; TENSILE BEHAVIOR; BRITTLE TRANSITION; VOLUME FRACTION; HIGH-STRENGTH; STEEL; MICROSTRUCTURE; DEFORMATION; CRACKING; NECKING;
D O I：
10.1016/j.compscitech.2016.02.011
中图分类号：
TB33 [复合材料];
学科分类号：
摘要：
The bending load-deflection curves and fracture characteristics of a range of laminated Ti-(TiBw/Ti) composites were investigated under five modes. The results show ductile-brittle transition with decreasing Ti layer thicknesses and increasing volume fractions of TiBw, which is attributed to the constrained plastic deformation mechanism accompanying with high stress traixiality and tensile stress. The laminated composites with weak interfaces display superior fracture toughness under notched crack arrested orientation, which is related to the delamination cracks and multiple tunnel cracks. Moreover, single tunnel crack propagation and periodic multiple tunnel cracks were observed in the laminated composites under mode IV, which depend on the thickness and ultimate strength ratio of ductile Ti layer and tough TiBw/Ti composite layer. There are many interfacial delamination cracks and multiple tunneling cracks presented under mode V, playing an effective role in toughening the laminated composites. In addition, with decreasing the Ti layer thickness, laminated composites reveal obvious size effect characterized by more tunnel cracks. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码：94 / 105
页数：12
相关论文
共 59 条
[1]   Micromechanical analysis of layered systems of MMCs subjected to bending-effects of thermal residual stresses [J].
Aghdam, MM ;
Kamalikhah, A .
COMPOSITE STRUCTURES, 2004, 66 (1-4) :563-569
[2]   Effect of interfacial compliance on bifurcation of a layer bonded to a substrate [J].
Bigoni, D ;
Ortiz, M ;
Needleman, A .
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1997, 34 (33-34) :4305-4326
[3]   Microstructure and fracture properties of an ultrahigh carbon steel-mild steel laminated composite [J].
Carreño, F ;
Chao, J ;
Pozuelo, M ;
Ruano, OA .
SCRIPTA MATERIALIA, 2003, 48 (08) :1135-1140
[4]   Production and Mechanical Properties of Roll Bonded Bulk Metallic Glass/Aluminum Laminates [J].
East, Daniel ;
Gibson, Mark A. ;
Liang, Daniel ;
Nie, Jian-Feng .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2013, 44A (05) :2010-2020
[5]   Revealing Extraordinary Intrinsic Tensile Plasticity in Gradient Nano-Grained Copper [J].
Fang, T. H. ;
Li, W. L. ;
Tao, N. R. ;
Lu, K. .
SCIENCE, 2011, 331 (6024) :1587-1590
[6]  
Go Y.H., 2007, MAT SCI ENG A, V460-461, P377
[7]   Microstructure and tensile behavior of Cu-Al multi-layered composites prepared by plasma activated sintering [J].
Guo, Yajie ;
Qiao, Guanjun ;
Jian, Wenzheng ;
Zhi, Xiaohui .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (20) :5234-5240
[8]   Ductile-brittle transition of pure Al-interlayer sandwiched by high strength Al alloy [J].
Han, LH ;
Li, L ;
Sun, J .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 403 (1-2) :165-173
[9]   Ductile to brittle transition of pure Al sheet constrained by strength mismatched parallel bi-interface [J].
Han, LH ;
Li, L ;
Sun, J .
SCRIPTA MATERIALIA, 2005, 52 (11) :1157-1162
[10]   THE MECHANICS OF CRACK-GROWTH IN LAYERED MATERIALS [J].
HE, MY ;
HEREDIA, FE ;
WISSUCHEK, DJ ;
SHAW, MC ;
EVANS, AG .
ACTA METALLURGICA ET MATERIALIA, 1993, 41 (04) :1223-1228
123456