The properties of epoxy resin coated silica fillers composites

被引：63
|
作者：
Teh, P. L.
Mariatti, M.
Akil, H. M.
Yeoh, C. K.
Seetharamu, K. N.
Wagiman, A. N. R.
Beh, K. S.
机构：
[1] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Perai 14300, Pulau Pinang, Malaysia
[2] MS Ramaiah Sch Adv Studies, Bangalore 560054, Karnataka, India
[3] Intel Technol Sdn Bhd, Assembly Technol Dev, Bayan Lepas 11900, Pulau Pinang, Malaysia
来源：
MATERIALS LETTERS | 2007年 / 61卷 / 11-12期
关键词：
epoxy; polymer; ceramic filler; electronic packaging;
D O I：
10.1016/j.matlet.2006.08.036
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal and flexural modulus. Apparently, the materials exhibit low coefficient of thermal expansion (CTE) at as low as or below 10 ppm/degrees C and high flexural modulus of above 20 GPa. In general, these promising characteristics fulfill the requirement to be used as substrate materials in electronic packaging applications. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码：2156 / 2158
页数：3
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