Testing and modelling of a novel ceiling panel for maintaining space relative humidity by moisture transfer

被引:26
作者
Fauchoux, Melanie [1 ]
Bansal, Mohit [2 ]
Talukdar, Prabal [2 ]
Simonson, Carey J. [1 ]
Torvi, David [1 ]
机构
[1] Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada
[2] Indian Inst Technol Delhi, Dept Mech Engn, New Delhi 110016, India
基金
加拿大自然科学与工程研究理事会; 加拿大创新基金会;
关键词
Radiant ceiling panels; Heat and moisture transfer; Indoor relative humidity; Experiments; Numerical modelling; HVAC; PRODUCTIVITY; SYSTEM; OFFICE;
D O I
10.1016/j.ijheatmasstransfer.2010.05.015
中图分类号
O414.1 [热力学];
学科分类号
摘要
Radiant ceiling panels are preferred over all-air systems because of their ability to lower energy consumption and maintain better comfort conditions. One disadvantage is their inability to moderate indoor humidity. To overcome this limitation, a new panel that can transfer heat and moisture is being developed. This research determines the performance of this panel under different temperature and humidity conditions. The effectiveness of the panel ranges from 15% to 28%, depending on the conditions. A computational fluid dynamics model of the panel has been developed using the commercial software, FLUENT. Good agreement is seen between experiments and the model for most cases. Comparing the change in humidity ratio of the air, the average difference is 5%. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:3961 / 3968
页数:8
相关论文
共 16 条
[1]  
[Anonymous], 551992 ANSIASHRAE
[2]  
[Anonymous], 2006, THESIS U SASKATCHEWA
[3]  
ASHRAE, 2008, ASHRAE HDB HVAC SYST
[4]  
ASTM, 1996, E10485 ASTM
[5]  
BRUNK MF, 1993, ASHRAE TRAN, V99, P479
[6]  
*CEN EN, 2007, 152512007 CEN EN
[7]  
Fauchoux M.T., 2009, J ASTM INT, V6
[8]  
Fauchoux M.T., 2008, P 8 S BUILD PHYS NOR, P1269
[9]  
*GRANT DES LTD, 2006, CES EDUPACK SEL VERS
[10]   Thermal comfort and energy consumption of the radiant ceiling panel system. Comparison with the conventional all-air system [J].
Imanari, T ;
Omori, T ;
Bogaki, K .
ENERGY AND BUILDINGS, 1999, 30 (02) :167-175