Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

被引：14
|
作者：
Horng, Ray-Hua [1 ]
Chen, Yi-Fan [1 ]
Wang, Chi-Han [1 ]
Chen, Hung-Yu [1 ]
机构：
[1] Natl Yang Ming Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan
来源：
IEEE ELECTRON DEVICE LETTERS | 2021年 / 42卷 / 07期
关键词：
Micro-LED (mu LED); metal bonding; display; wall plug efficiency; LIGHT-EMITTING-DIODES; ALGAINP; PERFORMANCE; FABRICATION; EXTRACTION; SURFACE;
D O I：
10.1109/LED.2021.3078778
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a 64 x 32 array inline structure of a micro-LED (mu LED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each mu LED was 100 mu m x 100 mu m. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the mu LED display. Au-In metal bonding demonstrated an excellent bonding result that can with-stand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75%.
引用
收藏
页码：1017 / 1020
页数：4
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