Transparent silica films deposited by low-temperature plasma-enhanced CVD using hexamethyldisiloxane

被引:0
作者
Teshima, K
Inoue, Y
Sugimura, H
Takai, O
机构
[1] Nagoya Univ, Grad Sch Engn, Dept Mat Proc Engn, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[2] Nagoya Univ, Res Ctr Nucl Mat Recycle, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[3] Dai Nippon Printing Co Ltd, Ctr Res & Dev, Adv Technol Lab, Kashiwa, Chiba 2770871, Japan
关键词
D O I
10.1002/1521-3862(20021203)8:6<251::AID-CVDE251>3.0.CO;2-3
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Communication: High-purity silica films have been-deposited at low substrate temperature by inductively coupled radiofrequency plasma-enhanced CVD using hexamethyldisiloxane add oxygen. Effects of deposition conditions on film composition are investigated. High-quality silica films are obtained under optimal deposition conditions of total pressure of 10 Pa and oxygen fraction of 76 % (see Figure).
引用
收藏
页码:251 / +
页数:4
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