Preparation and Characterization of Thermoelectric Thin-Film Devices Consisting of Co-Evaporated Bi2Te3 and Sb2Te3 Films

被引:2
作者
Kim, Jae-Hwan [1 ]
Oh, Tae-Sung [1 ]
机构
[1] Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea
基金
新加坡国家研究基金会;
关键词
Thermoelectric Device; Thin Film; Flip Chip; Co-Evaporation; Bismuth Telluride; Antimony Telluride; P-TYPE; FABRICATION; DEPOSITION; MICROSTRUCTURES; TEMPERATURE;
D O I
10.1166/sam.2015.2094
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A cross-plane thermoelectric thin-film device was obtained by flip-chip bonding the top substrate, which consisted of 50 pairs of co-evaporated n-type Bi2Te3 and p-type Sb2Te3 thin-film legs, to Cu/Au bumps in the bottom substrate. The actual temperature difference Delta T-G working across the thin-film legs was estimated to be 5 times smaller than the apparent temperature difference Delta T applied across the thin-film device. The thin-film device exhibited an open-circuit voltage of 50.7 mV and a maximum output power of 2.81 mu W when an apparent temperature difference Delta T of 38.9 K was applied across the top and bottom substrates of the thin-film device.
引用
收藏
页码:144 / 150
页数:7
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