共 33 条
Preparation and Characterization of Thermoelectric Thin-Film Devices Consisting of Co-Evaporated Bi2Te3 and Sb2Te3 Films
被引:2
作者:

Kim, Jae-Hwan
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机构:
Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea

Oh, Tae-Sung
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h-index: 0
机构:
Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea
机构:
[1] Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea
基金:
新加坡国家研究基金会;
关键词:
Thermoelectric Device;
Thin Film;
Flip Chip;
Co-Evaporation;
Bismuth Telluride;
Antimony Telluride;
P-TYPE;
FABRICATION;
DEPOSITION;
MICROSTRUCTURES;
TEMPERATURE;
D O I:
10.1166/sam.2015.2094
中图分类号:
TB3 [工程材料学];
学科分类号:
0805 ;
080502 ;
摘要:
A cross-plane thermoelectric thin-film device was obtained by flip-chip bonding the top substrate, which consisted of 50 pairs of co-evaporated n-type Bi2Te3 and p-type Sb2Te3 thin-film legs, to Cu/Au bumps in the bottom substrate. The actual temperature difference Delta T-G working across the thin-film legs was estimated to be 5 times smaller than the apparent temperature difference Delta T applied across the thin-film device. The thin-film device exhibited an open-circuit voltage of 50.7 mV and a maximum output power of 2.81 mu W when an apparent temperature difference Delta T of 38.9 K was applied across the top and bottom substrates of the thin-film device.
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页码:144 / 150
页数:7
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