Effect of Ag addition on the corrosion properties of Sn-based solder alloys

被引：34

作者：

Bui, Q. V. ^{[1
]}

Nam, N. D. ^{[1
]}

Noh, B-I. ^{[1
]}

Kar, A. ^{[1
]}

Kim, J. -G. ^{[1
]}

Jung, S. -B. ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Dept Adv Mat Engn, Suwon 440746, South Korea

来源：

MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION | 2010年 / 61卷 / 01期

关键词：

LEAD-FREE SOLDERS; INTERFACIAL REACTIONS; CU; BEHAVIOR; JOINTS; NACL;

D O I：

10.1002/maco.200905237

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Corrosion properties of three different Sn-Ag lead free solder alloys have been investigated in 0.3 wt% Na2SO4 solution as corrosive environment. As cast solder alloy was analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM).Volume fractions of the Ag3Sn in the solders were determined by image analysis technique. Pitting potential and corrosion potential for the alloys were determined by potentiodynamic tests. Electrochemical impedance spectroscopy (EIS) was carried out to measure the film and charge transfer resistance. Alloys with lower Ag content have been found as better corrosion resistance material.

引用

页码：30 / 33

页数：4

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