Oxidation Mechanism and Surface Passivation of Germanium by Ozone

被引:0
作者
Wang, Xiaolei [1 ]
Xiang, Jinjuan [1 ]
Zhao, Chao [1 ,2 ]
Ye, Tianchun [1 ,2 ]
Wang, Wenwu [1 ,2 ]
机构
[1] Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China
[2] Univ Chinese Acad Sci, Sch Microelect, Beijing 100049, Peoples R China
来源
2017 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM) | 2017年
关键词
Germanium; Ozone oxidation; interface state density; passivation;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Oxidation mechanism and passivation of Ge surface by ozone is experimentally investigated. The GeOx oxidation process contains two regions: initial linear growth region and following parabolic growth region. The linear growth region contains reaction of oxygen atoms with surface bond and back bonds of outmost Ge layer. The parabolic growth region starts when the oxygen atoms diffuse into back bonds of second outmost Ge layers. Furthermore, in the ozone oxidation it is not O3 molecules but O radicals that go through the GeOx film. The interface state density (Dit) is found to decrease with increasing the GeOx thickness (0.26-1.06 nm). X-ray photoelectron spectroscopy (XPS) results show that Ge3+ oxide component is responsible to the decrease of D-it.
引用
收藏
页码:162 / 163
页数:2
相关论文
共 5 条
[1]   Radical oxidation of germanium for interface gate dielectric GeO2 formation in metal-insulator-semiconductor gate stack [J].
Kobayashi, Masaharu ;
Thareja, Gaurav ;
Ishibashi, Masato ;
Sun, Yun ;
Griffin, Peter ;
McVittie, Jim ;
Pianetta, Piero ;
Saraswat, Krishna ;
Nishi, Yoshio .
JOURNAL OF APPLIED PHYSICS, 2009, 106 (10)
[2]  
Kuzum D., 2008, Electron Device Letters, IEEE, V29, P328
[3]  
LEE CH, 2011, TED, V58, P1295
[4]  
Wang X., 2015, ASS, V357, P1857
[5]  
Zhang R., 2013, TED, V60, P927