Effect of Polymer Additives and Chloride Ions on Electrodeposition Behavior and Morphology of Electrolytic Copper Powder

被引：1

作者：

Ochi, Kentaro ^{[1
,2
]}

Sekiguchi, Makoto ^{[2
]}

Oue, Satoshi ^{[3
]}

Nakano, Hiroaki ^{[3
]}

机构：

[1] Kyushu Univ, Grad Sch Engn, Dept Mat Proc Engn, Fukuoka 8190395, Japan

[2] Mitsui Min & Smelting Co Ltd, Hiroshima 7250025, Japan

[3] Kyushu Univ, Fac Engn, Dept Mat Sci & Engn, Fukuoka 8190395, Japan

来源：

JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS | 2021年 / 85卷 / 07期

关键词：

electrolytic copper powder; chloride ions; polyethyleneimine; polyethylene glycol; electrodeposition; polarization curve; current efficiency; morphology; charge transfer; diffusion; rate-determining;

D O I：

10.2320/jinstmet.J2021018

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

To investigate the effect of polymer additives and chloride ions on the electrodeposition behavior and morphology of copper powder, the polarization curves were measured and constant current electrolysis of 300 A.m(-2) and 500 A.m(-2) was conducted in an electrolytic solution containing 0.079 mol.dm(-3) of Cu2+ and 0.5 mol.dm(-3) of free H2SO4 at 293K and 393 K without stirring. Polyethylene glycol (PEG) and polyethyleneimine (PEI) were used as polymer additives. PEG and PEI had a suppressing effect on the electrodeposition of copper powder. The current efficiency for Cu deposition decreased with the addition of PEG and PEI. The addition of PEG decreased the average particle size of the copper powder, while PEI didn't change the average particle size. When Cl- coexisted with PEG, the suppressing effect on the electrodeposition of copper powder became even greater and the particle size of the copper powder became finer than when Cl- or PEG was added alone.

引用

页码：264 / 272

页数：9

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