A Minimally Invasive 64-Channel Wireless μECoG Implant

被引:283
作者
Muller, Rikky [1 ,2 ]
Le, Hanh-Phuc [1 ,3 ]
Li, Wen [1 ]
Ledochowitsch, Peter [4 ,5 ,6 ]
Gambini, Simone [7 ]
Bjorninen, Toni [8 ]
Koralek, Aaron [9 ]
Carmena, Jose M. [1 ,9 ]
Maharbiz, Michel M. [1 ,4 ,5 ]
Alon, Elad [1 ]
Rabaey, Jan M. [1 ]
机构
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[2] Cortera Neurotechnol Inc, Berkeley, CA 94704 USA
[3] Lion Semicond Inc, Berkeley, CA 94720 USA
[4] Univ Calif Berkeley, Dept Bioengn, Berkeley, CA 94720 USA
[5] Univ San Francisco, San Francisco, CA 94143 USA
[6] Allen Inst Brain Sci, Seattle, WA 98103 USA
[7] Univ Melbourne, Dept Elect Engn, Melbourne, Vic, Australia
[8] Tampere Univ Technol, FI-33101 Tampere, Finland
[9] Univ Calif Berkeley, Hellen Wills Neurosci Inst, Berkeley, CA 94720 USA
关键词
Brain; ECoG; EEG; implant; in vivo; low power; neural; recording; rectifier; wireless; DESIGN; SYNCHRONIZATION; CIRCUIT;
D O I
10.1109/JSSC.2014.2364824
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Emerging applications in brain-machine interface systems require high-resolution, chronic multisite cortical recordings, which cannot be obtained with existing technologies due to high power consumption, high invasiveness, or inability to transmit data wirelessly. In this paper, we describe a microsystem based on electrocorticography (ECoG) that overcomes these difficulties, enabling chronic recording and wireless transmission of neural signals from the surface of the cerebral cortex. The device is comprised of a highly flexible, high-density, polymer-based 64-channel electrode array and a flexible antenna, bonded to 2.4 mm x 2.4 mm CMOS integrated circuit (IC) that performs 64-channel acquisition, wireless power and data transmission. The IC digitizes the signal from each electrode at 1 kS/s with 1.2 mu V input referred noise, and transmits the serialized data using a 1 Mb/s backscattering modulator. A dual-mode power-receiving rectifier reduces data-dependent supply ripple, enabling the integration of small decoupling capacitors on chip and eliminating the need for external components. Design techniques in the wireless and baseband circuits result in over 16x reduction in die area with a simultaneous 3x improvement in power efficiency over the state of the art. The IC consumes 225 mu W and can be powered by an external reader transmitting 12 mW at 300 MHz, which is over 3x lower than IEEE and FCC regulations.
引用
收藏
页码:344 / 359
页数:16
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