Array Antenna Integrated Fan-out Wafer Level Packaging (InFO-WLP) for Millimeter Wave System Applications

被引：0

作者：

Tsai, Chung-Hao ^{[1
]}

Hsieh, Jeng-Shien ^{[1
]}

Liu, Monsen ^{[1
]}

Yeh, En-Hsiang ^{[1
]}

Chen, Hsu-Hsien ^{[1
]}

Hsiao, Ching-Wen ^{[1
]}

Chen, Chen-Shien ^{[1
]}

Liu, Chung-Shi ^{[1
]}

Lii, Mirng-Ji ^{[1
]}

Wang, Chuei-Tang ^{[1
]}

Yu, Doug ^{[1
]}

机构：

[1] TSMC Ltd, R&D, Hsinchu 30844, Hsinchu County, Taiwan

来源：

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2013年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluated first and proved to have 5 dBi of gain. Meanwhile, the interconnect from chip to antenna feeding line is demonstrated to only have 0.7 dB loss, which can save 19 % PA output power compared with that of flip-chip package. Finally, the system performance of 4 x 4 antenna array integrated with RF chip on the InFO structure shows 14.7 dBi of array gain in a small form factor of 10 x 10 x 0.5 mm(3).

引用

页数：4

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