Array Antenna Integrated Fan-out Wafer Level Packaging (InFO-WLP) for Millimeter Wave System Applications

被引：0
作者：
Tsai, Chung-Hao [1 ]
Hsieh, Jeng-Shien [1 ]
Liu, Monsen [1 ]
Yeh, En-Hsiang [1 ]
Chen, Hsu-Hsien [1 ]
Hsiao, Ching-Wen [1 ]
Chen, Chen-Shien [1 ]
Liu, Chung-Shi [1 ]
Lii, Mirng-Ji [1 ]
Wang, Chuei-Tang [1 ]
Yu, Doug [1 ]
机构：
[1] TSMC Ltd, R&D, Hsinchu 30844, Hsinchu County, Taiwan
来源：
2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluated first and proved to have 5 dBi of gain. Meanwhile, the interconnect from chip to antenna feeding line is demonstrated to only have 0.7 dB loss, which can save 19 % PA output power compared with that of flip-chip package. Finally, the system performance of 4 x 4 antenna array integrated with RF chip on the InFO structure shows 14.7 dBi of array gain in a small form factor of 10 x 10 x 0.5 mm(3).
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页数：4
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