DC-to-Ka-Band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing

被引：0

作者：

Qayyum, Jubaid Abdul ^{[1
]}

Crump, Cameron ^{[1
]}

Albrecht, John ^{[1
]}

Ulusoy, Ahmet Cagri ^{[2
]}

Papapolymerou, John ^{[1
]}

机构：

[1] Michigan State Univ, E Lansing, MI 48824 USA

[2] KIT, Karlsruhe, Germany

来源：

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页数：1

共 34 条

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