DC-to-Ka-Band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing

被引：0
|
作者：
Qayyum, Jubaid Abdul [1 ]
Crump, Cameron [1 ]
Albrecht, John [1 ]
Ulusoy, Ahmet Cagri [2 ]
Papapolymerou, John [1 ]
机构：
[1] Michigan State Univ, E Lansing, MI 48824 USA
[2] KIT, Karlsruhe, Germany
来源：
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2020年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页数：1
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