Recent progress in packaging of RF MEMS

被引：2
|
作者：
Seki, T [1 ]
机构：
[1] OMRON Corp, Adv Device Lab, Kyoto, Japan
来源：
2004 IEEE CSIC SYMPOSIUM, TECHNICAL DIGEST 2004: 26TH ANNIVERSARY: COMPOUNDING YOUR CHIPS IN MONTEREY | 2004年
关键词：
RF MEMS; wafer level packaging (WLP); frit glass;
D O I：
10.1109/CSICS.2004.1392547
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
RF MEMS devices utilized micromachining technologies offer a high performance to several RF applications. However packaging for devices have reduced performance problem when integrated to another RF devices. This paper will be reviewed the recent progress in Packaging of RF MEMS especially switching devices. And, a novel method of wafer level packaging for RF-MEMS switch will be described.
引用
收藏
页码：233 / 236
页数：4
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