Development of millimeter-wave GaNHFET technology

被引:9
作者
Higashiwaki, M. [1 ]
Mimura, T.
Matsui, T.
机构
[1] Natl Inst Informat & Commun Technol, Koganei, Tokyo 1848795, Japan
[2] Fujitsu Labs Ltd, Atsugi, Kanagawa 2430197, Japan
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2007年 / 204卷 / 06期
关键词
D O I
10.1002/pssa.200674860
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper describes approaches that we have used to improve the high-frequency device characteristics of GaN-based heterostructure field-effect transistors (HFETs). We developed three novel techniques to suppress short-channel effects: high-Al-composition and thin barrier layers, SiN passivation by catalytic chemical vapor deposition, and sub-100-nm Ti-based gates. These techniques were used to enhance the high-frequency device characteristics of Al-0.4 Ga-0.6 N/GaN HFETs, which had a record current-gain cutoff frequency of 181 GHz. In addition, high-performance depletion- and enhancement-mode AlN/GaN HFETs, which had DC and RF device characteristics fully comparable with those of state-of-the-art AlGaN/GaN HFETs, were also fabricated with these techniques. (c) 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
引用
收藏
页码:2042 / 2048
页数:7
相关论文
共 17 条
[1]   Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures [J].
Ambacher, O ;
Smart, J ;
Shealy, JR ;
Weimann, NG ;
Chu, K ;
Murphy, M ;
Schaff, WJ ;
Eastman, LF ;
Dimitrov, R ;
Wittmer, L ;
Stutzmann, M ;
Rieger, W ;
Hilsenbeck, J .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (06) :3222-3233
[2]   SHORT-CHANNEL EFFECTS IN SUBQUARTER-MICROMETER-GATE HEMTS - SIMULATION AND EXPERIMENT [J].
AWANO, Y ;
KOSUGI, M ;
KOSEMURA, K ;
MIMURA, T ;
ABE, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (10) :2260-2266
[3]   Trapping effects and microwave power performance in AlGaN/GaN HEMTs [J].
Binari, SC ;
Ikossi, K ;
Roussos, JA ;
Kruppa, W ;
Park, D ;
Dietrich, HB ;
Koleske, DD ;
Wickenden, AE ;
Henry, RL .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (03) :465-471
[4]   Influence of surface processing and passivation on carrier concentrations and transport properties in AlGaN/GaN heterostructures [J].
Dang, XZ ;
Yu, ET ;
Piner, EJ ;
McDermott, BT .
JOURNAL OF APPLIED PHYSICS, 2001, 90 (03) :1357-1361
[5]   Transient electron transport in wurtzite GaN, InN, and AlN [J].
Foutz, BE ;
O'Leary, SK ;
Shur, MS ;
Eastman, LF .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (11) :7727-7734
[6]   AlGaN/GaN MIS HFETs with fT of 163 GHz using Cat-CVD SiN gate-insulating and passivation layers [J].
Higashiwaki, M ;
Matsui, T ;
Mimura, T .
IEEE ELECTRON DEVICE LETTERS, 2006, 27 (01) :16-18
[7]   AlGaN/GaN heterostructure field-effect transistors with current gain cut-off frequency of 152 GHz on sapphire substrates [J].
Higashiwaki, M ;
Matsui, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2005, 44 (16-19) :L475-L478
[8]   Cat-CVD SiN-passivated AlGaN-GaNHFETs with thin and high al composition barrier layers [J].
Higashiwaki, M ;
Hirose, N ;
Matsui, T .
IEEE ELECTRON DEVICE LETTERS, 2005, 26 (03) :139-141
[9]   Barrier thickness dependence of electrical properties and DC device characteristics of AlGaN/GaN heterostructure field-effect transistors grown by plasma-assisted molecular-beam epitaxy [J].
Higashiwaki, M ;
Matsui, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (9A-B) :L1147-L1149
[10]  
HIGASHIWAKI M, 2007, IEEE T ELECTRON DEVI