A Novel Double-Sided Cooling Inverter Leg for High Power Density EV Based on Customized SiC Power Module

被引：0

作者：

Liu, Xinmin ^{[1
]}

Yan, Yiyang ^{[1
]}

Chen, Cai ^{[1
]}

Wu, Zongheng ^{[1
]}

Kang, Yong ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Elect & Elect Engn, Wuhan, Peoples R China

来源：

2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE) | 2020年

关键词：

double-sided cooling; SiC module; parasitic inductance; non-flipped-chip; double-ended;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Double-sided cooling (DSC) power module is particularly attractive for EV due to its low parasitic inductance and high thermal performance. This paper proposed a novel double-ended input terminals double-sided cooling SiC power module inverter leg. It has lower parasitic, lower thermal resistance and symmetrical current sharing.The simulations of thermal resistance and parasitic are compared for different types of module structures in this paper. The results shown that the double-ended structure has the optimal parasitic inductance with 10.6nH. Details of the DSC module layout, fabrication processes are discussed for a 294A/1200V module. The static and dynamic experimental results verify the design.

引用

页码：3151 / 3154

页数：4

共 35 条

[31] Reliability-Oriented Automated Design of Double-Sided Cooling Power Module: A Thermo-Mechanical-Coordinated and Multi-Objective-Oriented Optimization Methodology
Zeng, Zheng
Ou, Kaihong
Wang, Liang
Yu, Yue
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2020, 20 (03) : 584 - 595
[32] Thermo-Mechanical Co-Design of Double Sided Cooling Power Module for Electric Vehicle Application
Zeng Z.
Ou K.
Wu Y.
Ke H.
Zhang X.
Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2020, 35 (14): : 3050 - 3064
[33] Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure
Chen, Cai
Huang, Zhizhao
Chen, Lichuan
Tan, Yifan
Kang, Yong
Luo, Fang
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2019, 34 (06) : 5579 - 5593
[34] A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure
Huang, Zhizhao
Chen, Cai
Xie, Yue
Yan, Yiyang
Kang, Yong
Luo, Fang
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2020, 8 (01) : 351 - 366
[35] A High Power Density Chip-on-Chip Gan-based Module with Ultra-Low Parasitic Inductance
Zhang, Yi
Wu, Zongheng
Chen, Cai
Kang, Yong
Peng, Han
2021 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2021), 2021, : 444 - 448

← 1 2 3 4 →