Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation

被引：10

作者：

Lim, JH

Kuk, K

Shin, SJ

Baek, SS

Kim, YJ

Shin, JW

Oh, YS

机构：

[1] Samsung Adv Inst Technol, Packaging Ctr, Yongin 449712, Gyeonggi Do, South Korea

[2] Samsung Electro Mech, Suwon 443743, Gyeonggi Do, South Korea

来源：

MICROELECTRONICS RELIABILITY | 2005年 / 45卷 / 3-4期

关键词：

D O I：

10.1016/j.microrel.2004.12.009

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a failure analysis result for enhancing the reliability of thermal inkjet printhead. A novel inkjet printhead is fabricated using MEMS process, and we analyze the failure mechanism of inkjet head based on detailed experimental observations and numerical simulations. The failures presented in this work showed three primary factors influencing the failure modes and lifetime of printhead; bubble cavitation damage, thermal fatigue, and electromigration of heater. The design modification of micro heater to avoid an early stage of failure by electromigration yields the reliability enhancement of thermal inkjet printhead. (C) 2004 Elsevier Ltd. All rights reserved.

引用

页码：473 / 478

页数：6

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