共 47 条
- [1] PRECISION EVALUATION FOR THERMAL FATIGUE LIFE OF POWER MODULE USING COUPLED ELECTRICAL-THERMAL-STRUCTURAL ANALYSIS PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, : 157 - 163
- [3] Precision Evaluation for Thermal Fatigue Life of Power Module using Coupled Electrical-Thermal-Mechanical Analysis 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 201 - 205
- [5] RELIABILITY EVALUATION ON DETERIORATION OF POWER DEVICE USING COUPLED ELECTRICAL-THERMAL-MECHANICAL ANALYSIS 2008 SECOND INTERNATIONAL CONFERENCE ON THERMAL ISSUES IN EMERGING TECHNOLOGIES - THEORY AND APPLICATION (THETA), 2008, : 205 - 210
- [6] Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 815 - 821
- [7] Reliability evaluation for power electronics device using electrical thermal and mechanical analysis 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 94 - 99
- [8] Study on Thermal Design due to Downsizing of Power Module Using Coupled Electrical-Thermal-Mechanical Analysis 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,