Interfacial morphology evolution of a novel room-temperature ultrasonic bonding method based on nanocone arrays

被引：12

作者：

Wang, Haozhe ^{[1
,2
]}

Ju, Longlong ^{[1
]}

Guo, Yukun ^{[1
]}

Mo, Xiu ^{[1
]}

Ma, Shuo ^{[1
]}

Hu, Anmin ^{[1
]}

Lia, Ming ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai 200240, Peoples R China

[2] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA

来源：

APPLIED SURFACE SCIENCE | 2015年 / 324卷

基金：

中国国家自然科学基金;

关键词：

Ultrasonic bonding; Nanocone arrays; Voids; Interfacial morphology; WIRE;

D O I：

10.1016/j.apsusc.2014.11.058

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The evolution of interfacial morphology is investigated in joints bonded by a newly developed ambient temperature ultrasonic bonding process based on Ni nano-cone arrays. This confirmed two types of void at the interface: a Type I void in the concave area among the cone-like nanocrystals, and a Type II void on the top of the cone-like nanocrystals. By increasing the bonding pressure or time, the Type I voids can be eliminated; however, a pressure threshold exists for the Type II voids, below which increasing the bonding time accelerates the formation of Type II voids. At pressures above this threshold, on the other hand, increasing the bonding time results in shrinkage of the Type II voids. Varying the pressure and time was also found to induce a change in the interfacial morphology from cone-like to ladder-like and finally a planar structure. In this way, the critical pressure for obtaining a solid bonding joint was found to be 7 MPa. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：849 / 853

页数：5

共 28 条

[1] Silver Nanoparticle Paste for Low-Temperature Bonding of Copper [J].