Electrical Behaviour of Flip-Chip Bonded Thin Silicon Chip-on-Foil Assembly during Bending

被引：0

作者：

Palavesam, Nagarajan ^{[1
]}

Bonfert, Detlef ^{[1
]}

Hell, Waltraud ^{[1
]}

Landesberger, Christof ^{[1
]}

Gieser, Horst ^{[1
]}

Kutter, Christoph ^{[1
]}

Bock, Karlheinz ^{[2
]}

机构：

[1] Fraunhofer Res Inst Modular Solid State Technol E, Hansastr 27d, D-80686 Munich, Germany

[2] Tech Univ Dresden, Fac Elect & Comp Engn, Elect Packaging Lab, Helmholtzstr 18, D-01062 Dresden, Germany

来源：

2015 IEEE 21ST INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME) | 2015年

关键词：

fatigue test; lifetime test; flexible electronics; mechanical reliability; daisy chain; ACA; Chip on Foil;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.

引用

页码：367 / 372

页数：6

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[2]

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[4]

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