Injection efficiency of CHISEL gate currents in short MOS devices: Physical mechanisms, device implications, and sensitivity to technological parameters

被引:26
作者
Esseni, D [1 ]
Selmi, L [1 ]
Ghetti, A [1 ]
Sangiorgi, E [1 ]
机构
[1] DIEGM, I-33100 Udine, Italy
关键词
charge injection; CHISEL; EEPROM; hot carriers; MOSFET scaling;
D O I
10.1109/16.877183
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper analyzes MOSFETs gate currents in the so-called channel initiated secondary electron injection regime (CHISEL), A Monte Carlo model of the phenomenon is validated and then extensively used to explore CHISEL scaling laws, Results indicate that, compared to conventional channel hot electron injection (CHE), CHISEL exhibits a weaker dependence on channel length and a larger sensitivity to short channel effects. These results are confirmed experimentally and exhaustively explained with the help of simulations; furthermore, some of their possible detrimental consequences on the programming efficiency of CHISEL based flash cells are analyzed, Finally, the impact of channel doping, oxide thickness, and junction depth on CHISEL efficiency has been explored, and guidelines to maintain high injection efficiency in short devices are derived.
引用
收藏
页码:2194 / 2200
页数:7
相关论文
共 28 条
[1]  
ABRAMO FA, 1995, IEDM, P301
[2]   Secondary electron flash -: a high performance, low power flash technology for 0.35 μm and below [J].
Bude, JD ;
Mastrapasqua, M ;
Pinto, MR ;
Gregor, RW ;
Kelley, PJ ;
Kohler, RA ;
Leung, CW ;
Ma, Y ;
McPartland, RJ ;
Roy, PK ;
Singh, R .
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, :279-282
[3]  
BUDE JD, 1995, P S VLSI TECHN, P101
[4]   ON-CHIP HIGH-VOLTAGE GENERATION IN MNOS INTEGRATED-CIRCUITS USING AN IMPROVED VOLTAGE MULTIPLIER TECHNIQUE [J].
DICKSON, JF .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1976, 11 (03) :374-378
[5]   HOT-ELECTRON INJECTION INTO THE OXIDE IN N-CHANNEL MOS DEVICES [J].
EITAN, B ;
FROHMANBENTCHKOWSKY, D .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1981, 28 (03) :328-340
[6]   Experimental signature and physical mechanisms of substrate enhanced gate current in MOS devices [J].
Esseni, D ;
Selmi, L .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :579-582
[7]  
Esseni D., 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), P275, DOI 10.1109/IEDM.1999.824150
[8]   A better understanding of substrate enhanced gate current in VLSI MOSFET's and flash cells - Part I: Phenomenological aspects [J].
Esseni, D ;
Selmi, L .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (02) :369-375
[9]   A new and flexible scheme for hot-electron programming of nonvolatile memory cells [J].
Esseni, D ;
Della Strada, A ;
Cappelletti, P ;
Riccò, B .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (01) :125-133
[10]   Bias and temperature dependence of homogeneous hot-electron injection from silicon into silicon dioxide at low voltages [J].
Fischer, B ;
Ghetti, A ;
Selmi, L ;
Bez, R ;
Sangiorgi, E .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (02) :288-296