Decapsulation Method for 3D Stacked-die Packaged Devices

被引：0
|
作者：
Lin, Xiaoling [1 ,2 ]
Liang, Chaohui [2 ]
机构：
[1] MIIT, Inst 5, Sci & Technol Lab Reliabil Phys & Applicat Elect, Guangzhou, Peoples R China
[2] MIIT, Inst 5, Reliabil Anal Ctr, Guangzhou, Peoples R China
来源：
2020 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2020年
关键词：
3D stacked-die package; MEMS inertial devices; decapsulation; inspection;
D O I：
10.1109/ipfa49335.2020.9260867
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
3-dimensional (3D) stacked-die package is one of the important package styles for MEMS inertial devices. Its unique packaging brings new challenges for its decapsulation method. In this paper, a new decapsulation method for 3D stacked-die packaged MEMS inertial devices is introduced with method's steps, technical flow and application. This decapsulation method is the combination of laser-decap and multi-steps chemical etching. It reveals the stacked-dies layer by layer and makes the possibility to analyze the structures in the MEMS inertial devices, such as accelerometer, gyroscope, ASIC, etc. It provides good technical support for inner-inspection of 3D stacked-die packaged MEMS inertial devices.
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页数：5
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